SPE-11-8-060/F
Page 21 of 21
5.0 Recommended Reflow Temperature Profile
(1) Time shown in the above figures is measured from the point when chip surface reaches
temperature.
(2) Temperature difference in high temperature part should be within 110癈.
(3) After soldering, do not force cool, allow the parts to cool gradually.
*General attention to soldering:
?High soldering temperatures and long soldering times can cause leaching of the termination,
decrease in adherence strength, and the change of characteristic may occur.
?for soldering, please refer to the soldering curves above. However, please keep exposure to
temperatures exceeding 200癈 to under 50 seconds.
?please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water soluble, be
sure to wash thoroughly to remove any residue from the underside of components that
could affect resistance.
Cleaning:
When using ultrasonic cleaning, the board may resonate if the output power is too high.
Since this vibration can cause cracking or a decrease in the adherence of the termination, we
recommend that you use the conditions below.
Frequency: 40 kHz max. - Output power: 20W/Iiter -Cleaning time: 5minutes max.
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